Kwi-Semiconductor, iigesi zenza wonke umsebenzi kunye ne-lasers zifumana ingqalelo yonke. Ngelixa i-lasers i-etch traistor kwi-silicon, i-ETK eqala ukubeka i-silicon kwaye ihlasele i-laser ukwenza isekethe epheleleyo luthotho lweegesi. Akumangalisi ukuba ezi geses, ezisetyenziselwa ukuphuhlisa iindawo ezincinci ngenkqubo yamanqanaba amaninzi, zibubunyulu obuphezulu. Ukongeza koku sikekelwa, uninzi lwabo lunezinye izinto ezixhalabisayo kunye nokusikelwa umda. Ezinye zeegesi ziigesi, ezinye ziyatyhafisa, kwaye ezinye zinetyhefu kakhulu.
Konke konke, ezi sithintele zenza iinkqubo zokuhambisa irhasi kwishishini le-semiconductor umngeni omkhulu. Iinkcazo zezinto ezibonakalayo ziyafuneka. Ukongeza kokucaciswa kwezinto, uluhlu lwegesi Iindawo ezihlanganisene kuzo zinzima kwaye zigqunywe. Ukufakwa kokugqibela kwenzeka kwindawo njengenxalenye yenkqubo yokufaka. I-Orbital Welding inceda ekuhlangabezeni iimfuno zokuthintela igesi ephezulu ngelixa usenza indawo eqinileyo nenomngeni ngakumbi.
Zisetyenziswa njani iigesi kwishishini le-semicondcuctor
Ngaphambi kokuzama ukucwangcisa ukwenziwa kwenkqubo yokuphinda kwenziwe igesi, kuyimfuneko ukuqonde okungenani iziseko zemveliso ye-semicondcuctoure. Kwisiqhelo, iSemicondors isebenzisa igesi ukubeka idipozithi kufutshane ne-slins yezinto ezikhoyo kumphezulu ngendlela elawulwa kakhulu. Ezi i-slidids ezibekiweyo emva koko zitshintshiwe ngokwazisa iigesi ezongeziweyo, ii-hasers, ezinye iitchabli zekhemikhali, kunye nobushushu. Amanyathelo akwinkqubo ebanzi zezi:
Ukufakwa: Le yinkqubo yokwenza i-selicon ye-silicon ye-silicon. Iigesi ze-Silicon PreCorr Gases ziyaphoswa kwi-fitser yegumbi lokufuduka kwaye zenze i-sefic ye-silicon ye-silicon ngekhemikhali okanye ukusebenzisana komzimba.
Ifoto yefoto: Icandelo lefoto libhekisa kwii-lars. Kwi-Ultraviot Lithography Lithography (i-EUV) I-Spectrum isetyenziselwa ukwenza ezona chips ziphezulu, i-carbon diokside laser isetyenziselwa ukufaka i-microprocess.
I-etch Le nkqubo ifaka ngokufanelekileyo i-laser-iprintiweyo ishicilele kwi-subtate.
Ukucocwa: Eli linyathelo elongeziweyo eliguqula ukuqhubela phambili kwendawo evuthayo ukumisela iimeko eziqhutywa phantsi kwe-semicondcuct.
I-ANNALEN: kule nkqubo, ukusabela phakathi kweendawo ze-wafered zibangelwa luxinzelelo oluphakamileyo kunye neqondo lobushushu. Ngokuyintloko, igqibezela iziphumo zenkqubo yangaphambili kwaye idala iprosesa egqityiweyo kwi-wafer.
Igumbi kunye nokucocwa komgca: Iigesi ezisetyenziswa kumanyathelo angaphambili, ngakumbi i-etching kwaye ihamba, zihlala zinetyhefu kwaye zisebenza. Ke ngoko, igumbi lenkqubo kunye nemigca yegesi isondondla kufuneka igcwaliswe ngokuchitha igesi ukunciphisa okanye ukuphelisa iigesi eziyingozi, emva koko zizaliswe ziigesi zokuthintela iigesi ezichasene nendawo engabusiyo evela kwimeko yangaphandle.
Iinkqubo zokuhambisa igesi kwishishini le-semicondcuctor zihlala zintsonkothileyo ngenxa yegesi ezininzi ezahlukeneyo ezichaphazelekayo kunye nolawulo oluqinileyo lokuhamba ngegesi, ubushushu kunye noxinzelelo ekufuneka lugcinwe ngaphezulu kwexesha. Oku kuntsonkotheka ngakumbi kukucoceka kwe-ultra-gesity efunekayo kwigesi nganye kwinkqubo. Iigesi ezisetyenziswa kwinyathelo elidlulileyo kufuneka zikhutshelwe ngaphandle kwemigca kunye namagumbi okanye ngenye indlela ngaphambi kwenqanaba elilandelayo lenkqubo linokuqalisa. Oku kuthetha ukuba kukho inani elikhulu lemigca ekhethekileyo, i-messer phakathi kweenkqubo ze-hube ze-welded kunye nee-hoses, ii-vaubers, kunye nee-tubes, kunye neendlela zokutsalwa kwegesi ezenzelwe ukukhulisa igesi yegesi.
Ukongeza, igesi engaphandle icocekile iya kufakwa kweenkqubo zokubonelela ngegesi ezininzi kwiindawo zokucoca kunye neendawo ezikhethekileyo zokunciphisa ukunciphisa. Ukucoca ezi nkqubo zegesi kwindawo entsonkothileyo ayisebenzi ngokulula. Nangona kunjalo, ngononophelo, ukuqwalaselwa kwiinkcukacha kunye nezixhobo ezifanelekileyo, lo msebenzi unokuphunyezwa ngempumelelo.
Iinkqubo zemveliso yegesi kwi-semicondcuctor
Izixhobo ezisetyenziswa kwi-semiconductor yegesi yokusasaza igesi iguquguquka kakhulu. Banokubandakanya izinto ezinje ngemibhobho yensimbi ye-ptfewe-eline kunye nee-hoses zokuxhathisa igesi. Esona sixhobo sixhaphakileyo esisetyenziselwa ukuqiniswa kwenjongo ngokubanzi kumzi-mveliso we-semiconductor yintsimbi ye-316l yentsimbi - i-carbon ye-carbon engaqhelekanga. Xa kufikwa kwi-316l ngokuchasene ne-316, 316l ixhaphake kakhulu kwi-insosion engaphakathi. Olu luthando olubalulekileyo xa ujongene noluhlu lweegesi ezisebenzayo kwaye ezinokubakho ezinokubangela i-carron. I-welding 316l yentsimbi ikhuphe intsimbi engaphantsi kwe-carbon encinci. Ikwanciphisa izinto ezinokubakho kumda wokudla okuziinkozo, ezinokukhokelela ekuphenduleni i-ilrosion nakwimihlaba echaphazelekayo.
Ukunciphisa ukubakho kokuntywila kwimveliso ekhokelela kwimveliso yemveliso yemveliso kunye nongcoliseko, i-316l yentsimbi yentsimbi ekhuselweyo ye-Argon ye-Argon Syrals yi-Wimicondcuctor. Inkqubo kuphela ebonelela ngolawulo olufunekayo ukugcina imeko ecocekileyo ecocekileyo yenkqubo. I-omemec officted idling ibonelela kuphela ngolawulo lwenkqubo ephindaphindiweyo efunekayo ukugqiba i-SODT kwi-SEEMIOSTUTER igesi yokusasaza igesi. Isibakala sokuba iintloko ezivaliweyo ze-SIVITE zinokufumana iindawo ezixineneyo nezinzima kwiindlela ezinzima phakathi kweendawo zenkqubo luncedo olubalulekileyo lwenkqubo.
I-Shenzhen Wofei iTekhnoloji Co., I-LTD, eneminyaka eli-10 yamava ekuboneleleni ngeegesi ze-semiconductor, i-LED, i-EPPE-LCD, kunye ne-DFT-LCD yeZinto ezifunekayo ukuzisa iimveliso zakho kumzi-mveliso. Asinakho ukubonelela ngoluhlu olubanzi lweevalves kunye nezixhobo zokufundisa ze-EMARTATRY GETASTARTY GETYS, kodwa ikwayila imizobo yegesi kunye nokufakwa kwezixhobo zabathengi bethu.
I-Post Tight: Jul-31-2023