Kwi-Semiconductor, iigesi zenza wonke umsebenzi kunye ne-lasers zifumana ingqalelo yonke. Ngelixa i-lasers i-etch traistor kwi-silicon, i-ETK eqala ukubeka i-silicon kwaye ihlasele i-laser ukwenza isekethe epheleleyo luthotho lweegesi. Akumangalisi ukuba ezi geses, ezisetyenziselwa ukuphuhlisa iindawo ezincinci ngenkqubo yamanqanaba amaninzi, zibubunyulu obuphezulu. Ukongeza koku sikekelwa, uninzi lwabo lunezinye izinto ezixhalabisayo kunye nokusikelwa umda. Ezinye zeegesi ziigesi, ezinye ziyatyhafisa, kwaye ezinye zinetyhefu kakhulu.
Konke konke, ezi sithintele zenza iinkqubo zokuhambisa irhasi kwishishini le-semiconductor umngeni omkhulu. Iinkcazo zezinto ezibonakalayo ziyafuneka. Ukongeza kokucaciswa kwezinto, uluhlu lwegesi Iindawo ezihlanganisene kuzo zinzima kwaye zigqunywe. Ukufakwa kokugqibela kwenzeka kwindawo njengenxalenye yenkqubo yokufaka. Ukuthengiswa kwe-orbrital kuyanceda ukuhlangabezana nengcaciso ephezulu yeemfuno zokusasazwa kwegesi ngelixa kusenziwa imeko eqinileyo, enomngeni ngakumbi.
Umzi mveliso we-semicondcuctor usebenzisa igesi
Ngaphambi kokuzama ukucwangcisa ukwenziwa kwenkqubo yokuphinda kwenziwe igesi, kuyimfuneko ukuqonde okungenani iziseko zemveliso ye-semicondcuctoure. Kwisiqhelo, iSemicondors isebenzisa igesi ukubeka idipozithi kufutshane ne-slins yezinto ezikhoyo kumphezulu ngendlela elawulwa kakhulu. Ezi i-slidids ezibekiweyo emva koko zitshintshiwe ngokwazisa iigesi ezongeziweyo, ii-hasers, ezinye iitchabli zekhemikhali, kunye nobushushu. Amanyathelo akwinkqubo ebanzi zezi:
Ukufakwa: Le yinkqubo yokwenza i-selicon ye-silicon ye-silicon. Iigesi ze-Silicon PreCorr Gases ziyaphoswa kwi-fitser yegumbi lokufuduka kwaye zenze i-sefic ye-silicon ye-silicon ngekhemikhali okanye ukusebenzisana komzimba.
Ifoto yefoto: Icandelo lefoto libhekisa kwii-lars. Kwi-Ultraviot Lithography Lithography (i-EUV) I-Spectrum isetyenziselwa ukwenza ezona chips ziphezulu, i-carbon diokside laser isetyenziselwa ukufaka i-microprocess.
I-etch Le nkqubo ifaka ngokufanelekileyo i-laser-iprintiweyo ishicilele kwi-subtate.
Ukucocwa: Eli linyathelo elongeziweyo eliguqula ukuqhubela phambili kwendawo evuthayo ukumisela iimeko eziqhutywa phantsi kwe-semicondcuct.
I-ANNALEN: kule nkqubo, ukusabela phakathi kweendawo ze-wafered zibangelwa luxinzelelo oluphakamileyo kunye neqondo lobushushu. Ngokuyintloko, igqibezela iziphumo zenkqubo yangaphambili kwaye idala iprosesa egqityiweyo kwi-wafer.
Igumbi kunye nokucocwa komgca: Iigesi ezisetyenziswa kumanyathelo angaphambili, ngakumbi i-etching kwaye ihamba, zihlala zinetyhefu kwaye zisebenza. Ke ngoko, igumbi lenkqubo kunye nemigca yegesi isondondla kufuneka igcwaliswe ngokuchitha igesi ukunciphisa okanye ukuphelisa iigesi eziyingozi, emva koko zizaliswe ziigesi zokuthintela iigesi ezichasene nendawo engabusiyo evela kwimeko yangaphandle.
Iinkqubo zokuhambisa igesi kwishishini le-semicondcuctor zihlala zintsonkothileyo ngenxa yegesi ezininzi ezahlukeneyo ezichaphazelekayo kunye nolawulo oluqinileyo lokuhamba ngegesi, ubushushu kunye noxinzelelo ekufuneka lugcinwe ngaphezulu kwexesha. Oku kuntsonkotheka ngakumbi kukucoceka kwe-ultra-gesity efunekayo kwigesi nganye kwinkqubo. Iigesi ezisetyenziswa kwinyathelo elidlulileyo kufuneka zikhutshelwe ngaphandle kwemigca kunye namagumbi okanye ngenye indlela ngaphambi kwenqanaba elilandelayo lenkqubo linokuqalisa. Oku kuthetha ukuba kukho inani elikhulu lemigca ekhethekileyo, intetho ephakathi kwenkqubo ye-hube ye-weldided kunye nee-hoses, ii-vous, iinkqubo zegesi kunye nee-vobles kunye nee-vobles kunye neendlela zokutsalwa kwegesi ezenzelwe ukuhanjiswa kwegesi.
Ukongeza, iindawo zokucoca zegumbi lokucoca kunye neegesi ezikhethekileyo ziya kufakelwa ngeenkqubo zokubonelela ngegesi ezininzi kwiindawo ezicocekileyo kunye neendawo ezikhethekileyo zokunciphisa ukuthomalalisa nayiphi na ingozi kwimeko yokuvuza ngengozi. Ukucoca ezi nkqubo zegesi kwindawo entsonkothileyo ayisebenzi ngokulula. Nangona kunjalo, ngononophelo, ukuqwalaselwa kwiinkcukacha kunye nezixhobo ezifanelekileyo, lo msebenzi unokuphunyezwa ngempumelelo.
Iinkqubo zemveliso yegesi kwi-semicondcuctor
Izixhobo ezisetyenziswa kwi-semiconductor yegesi yokusasaza igesi iguquguquka kakhulu. Banokubandakanya izinto ezinje ngemibhobho yensimbi ye-ptfewe-eline kunye nee-hoses zokuxhathisa igesi. Esona sixhobo sixhaphakileyo esisetyenziselwa ukuqiniswa kwenjongo ngokubanzi kumzi-mveliso we-semiconductor yintsimbi ye-316l yentsimbi - i-carbon ye-carbon engaqhelekanga. Xa kufikwa kwi-316l ngokuchasene ne-316, 316l ixhaphake kakhulu kwi-insosion engaphakathi. Olu luthando olubalulekileyo xa ujongene noluhlu lweegesi ezisebenzayo kwaye ezinokubakho ezinokubangela i-carron. I-welding 316l yentsimbi ikhuphe intsimbi engaphantsi kwe-carbon encinci. Ikwanciphisa izinto ezinokubakho kumda wokudla okuziinkozo, ezinokukhokelela ekuphenduleni i-ilrosion nakwimihlaba echaphazelekayo.
Ukunciphisa ukubakho kokuntywila kwimveliso ekhokelela kwimveliso yemveliso yemveliso kunye nongcoliseko, i-316l yentsimbi yentsimbi ekhuselweyo ye-Argon ye-Argon Syrals yi-Wimicondcuctor. Inkqubo kuphela ebonelela ngolawulo olufunekayo ukugcina imeko ecocekileyo ecocekileyo yenkqubo. I-omemed orling ye-ofisi ye-welbital ifumaneka kuphela ekusasazeni igesi ye-semiconductor
IXESHA LOKUQALA: UJUL-18-2023